Products
Thin-film
CMF Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thin film technology
- High-precision resistor layers
- Resistance area coated with surface passivation
- Highest stability and reliability
- Very tight tolerances (<=0,05%) – low temperature coefficient (<=10ppm/K)
- Low current noise, good pulse strength
- R-Value-Matching available
- RoHS-conform
- Order quantities from 1000 pieces for <1% and <TCR 50 available by extra charge
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
CMP Sizes: 0402, 0603, 0805, 1206
Characteristics:
- Chip resistors in thin film technology
- High-precision resistor layers
- Resistance area coated with surface passivation
- Highest stability and reliability
- Very tight tolerances (=0,05%) – low temperature coefficient (=10ppm/K)
- Low current noise, good pulse strength
- R-Value-Matching available
- RoHS-conform
- Order quantities from 1000 pieces for <1% and <TCR 50 available by extra charge
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
CMV Sizes: 1206, 2512
Characteristics:
- Chip resistors in thin film technology with higher voltage resistance
- High-precision resistor layers
- Resistance area coated with surface passivation
- Highest stability and reliability
- Very tight tolerances (=0,05%) – low temperature coefficient (=10ppm/K)
- Low current noise, good pulse strength
- RoHS-conform
- Order quantities from 1000 pieces for <1% and <TCR 50 available by extra charge
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
CMA Sizes: 1206-4 (4 x 0603)
Characteristics:
- Chip resistors in thin film technology
- Four resistors with 2 circuit variants
- Concave contact
- Resistance area coated with surface passivation
- High stability and reliability
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
CMF-Jumper Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thin film technology
- RoHS-conform
- Customer specific barcodes available – also in 2D
- Electroplated pure tin
CPT Sizes: 0805, 1206
Characteristics:
- Temperature sensors in thin film technology
- Wide area of temperature measurement from -50 to +150°C
- Standardized nominal values and tolerances
- High measurement accuracy and good long time stability
- Good linear characteristic curves
- Varnish passivation
- Galvanic wrap-around contact with diffusion barrier
- Suitable for automatic large-scale production
- Tape packaging acc. DIN IEC 286-3
- RoHS-conform
CTP Sizes: 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
Thick-film
CDF Sizes: 0402, 0603, 0805, 1206
Characteristics:
- Chip resistors in thick film technology
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances (=0,5%) – low temperature coefficient
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact –K
- Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
CLF Sizes: 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Special layout for high electrical load
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances (=0,5%) – low temperature coefficient (=50ppm/K)
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
- Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
CDP Sizes: 0402, 0603, 0805, 1206
Characteristics:
- Chip resistors in thick film technology
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances (=0,5%) – low temperature coefficient
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
- Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
CNF Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Very low ohmic resistor layers
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
CHF Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Very high ohmic resistor layers
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances
- RoHS-conform
- Standard measuring voltage: 50V
- Application-specific measuring voltage acc. customer specifications available
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
- Special corrosive gas resistant contact –S, Sulfur resistance verified according
to ASTM B 809
CRA Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Resistance area trimmable after manufacturing
- Maximum trimming factor=1,3; higher factors by reducing of Umax or P70 available
- Resistance area coated with glass passivation
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact –K
- Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
CQA Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Resistance area trimmable after manufacturing, clearly seperated for detecting by visual systems
- Maximum trimming factor=1,3; higher factors by reducing of Umax or P70 available
- Resistance area coated with glass passivation
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact –K
- Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
CDI / CLI Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Specially pulse proof resistor layers
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Sticky contact –K
- Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
CNR Sizes: 1206-4 (4 x 0603)
Characteristics:
- Chip resistors in thick film technology
- Four value-equal resistors arranged on one chip to save space
- Contact inside round surfaces of ceramic
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances (=1%) – low temperature coefficient
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact –K
- Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
CDF / CLF-Jumper Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Resistance area coated with glass and varnish passivation
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
Automotive
AMF Sizes: 0603, 0805, 1206
Characteristics:
- Chip resistors in thin film technology
- High-precision resistor layers
- Resistance area coated with surface passivation
- AEC Q200 qualified
- Very tight tolerances (=0,05%) – low temperature coefficient (=10ppm/K)
- Low current noise, good pulse strength
- R-Value-Matching available
- RoHS-conform
- Order quantities from 1000 pieces for <1% and <TCR 50 available by extra charge
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
AMA Sizes: 1206-4 (4 x 0603)
Characteristics:
- Chip resistors in thin film technology
- Four resistors with 2 circuit variants
- Concave contact
- Resistance area coated with surface passivation
- High stability and reliability
- AEC Q200 qualified
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
AMF-Jumper Sizes: 0603, 0805, 1206
Characteristics:
- Chip resistors in thin film technology
- AEC Q200 qualified
- RoHS-conform
- Customer specific barcodes available – also in 2D
- Electroplated pure tin
ADF Sizes: 0402, 0603, 0805, 1206
Characteristics:
- Chip resistors in thick film technology
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- AEC Q200 qualified
- Tight tolerances (=0,5%) – low temperature coefficient
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
ALF Sizes: 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Special layout for high electrical load
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- AEC Q200 qualified
- Tight tolerances (=0,5%) – low temperature coefficient (=50ppm/K)
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
ANF Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Very low ohmic resistor layers
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances
- AEC Q200 qualified
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
AHF Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Very high ohmic resistor layers
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances
- AEC Q200 qualified
- RoHS-conform
- Standard measuring voltage: 50V
- Application-specific measuring voltage acc. customer specifications available
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
ARA Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Resistance area trimmable after manufacturing
- Maximum trimming factor=1,3; higher factors by reducing of Umax or P70 available
- Resistance area coated with glass passivation
- AEC Q200 qualified
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
AQA Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Resistance area trimmable after manufacturing, clearly seperated for detecting by visual systems
- Maximum trimming factor=1,3; higher factors by reducing of Umax or P70 available
- Resistance area coated with glass passivation
- AEC Q200 qualified
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
ADI / ALI Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Specially pulse proof resistor layers
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- AEC Q200 qualified
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
ANR Sizes: 1206-4 (4 x 0603)
Characteristics:
- Chip resistors in thick film technology
- Four value-equal resistors arranged on one chip to save space
- Contact inside round surfaces of ceramic
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances (=1%) – low temperature coefficient
- AEC Q200 qualified
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
ADF-Jumper Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Resistance area coated with glass and varnish passivation
- AEC Q200 qualified
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
Data Sheets downloads
Application specific solutions and components
SMD chip resistors, networks and temperature sensors are designed for use in almost all areas of electronics. Our innovative technologies and high technical expertise allow us to be able to offer application-specific solutions. Here are some examples:
- Automotive series, SMD chip resistors, which meets the special requirements of the customers in the automotive industry
- Low ohmic series, SMD chip resistors, which can be used as current sensors
- High ohmic series, SMD chip resistors, which can be used in measuring amplifiers
- High power series, SMD chip resistors, specifically for use in power electronics and automotive technology etc.
- Trimmable series, SMD chip resistors, whose resistance value can be self-adjusted by the customer for special applications
- Pulse proof series, SMD chip resistors, wich can be used in power supplies etc.
- Networks, SMD chip resistors, specifically for use in highly integrated circuits
- Thin-film series, SMD chip resistors, which are used everywhere, especially if high precision and reliability is required, such as in medical, aviation or scientific equipment
- Temperature sensors, sensors in SMD technology for application in temperature measurement and control technology
- Placemats (CUT-K), specific SMD component with the form of a metallized ceramic substrate wich is used as an assembly base
- Testpoints, specific implementation of an SMD chip resistor (0 Ohm), which can be used as a measuring point on circuit boards
- Compensation resistors, thin film chip resistor within low resistance range with a specifically produced temperature coefficient in the range of +2000 ppm/K
- Heat-pipe, SMD component for use as a specific heat sink for circuit boards
- Matching resistors, specially selected chip resistors wich have a difference of resistance values of only +/-0.02% inside one packaging unit
