Produkte
Dünnschicht
CMF Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thin film technology
- High-precision resistor layers
- Resistance area coated with surface passivation
- Highest stability and reliability
- Very tight tolerances (<=0,05%) – low temperature coefficient (<=10ppm/K)
- Low current noise, good pulse strength
- R-Value-Matching available
- RoHS-conform
- Order quantities from 1000 pieces for <1% and <TCR 50 available by extra charge
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
CMP Sizes: 0402, 0603, 0805, 1206
Characteristics:
- Chip resistors in thin film technology
- High-precision resistor layers
- Resistance area coated with surface passivation
- Highest stability and reliability
- Very tight tolerances (=0,05%) – low temperature coefficient (=10ppm/K)
- Low current noise, good pulse strength
- R-Value-Matching available
- RoHS-conform
- Order quantities from 1000 pieces for <1% and <TCR 50 available by extra charge
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
CMV Sizes: 1206, 2512
Characteristics:
- Chip resistors in thin film technology with higher voltage resistance
- High-precision resistor layers
- Resistance area coated with surface passivation
- Highest stability and reliability
- Very tight tolerances (=0,05%) – low temperature coefficient (=10ppm/K)
- Low current noise, good pulse strength
- RoHS-conform
- Order quantities from 1000 pieces for <1% and <TCR 50 available by extra charge
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
CMA Sizes: 1206-4 (4 x 0603)
Characteristics:
- Chip resistors in thin film technology
- Four resistors with 2 circuit variants
- Concave contact
- Resistance area coated with surface passivation
- High stability and reliability
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
CMF-Jumper Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thin film technology
- RoHS-conform
- Customer specific barcodes available – also in 2D
- Electroplated pure tin
CPT Sizes: 0805, 1206
Characteristics:
- Temperature sensors in thin film technology
- Wide area of temperature measurement from -50 to +150°C
- Standardized nominal values and tolerances
- High measurement accuracy and good long time stability
- Good linear characteristic curves
- Varnish passivation
- Galvanic wrap-around contact with diffusion barrier
- Suitable for automatic large-scale production
- Tape packaging acc. DIN IEC 286-3
- RoHS-conform
CTP Sizes: 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
Dickschicht
CDF Sizes: 0402, 0603, 0805, 1206
Characteristics:
- Chip resistors in thick film technology
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances (=0,5%) – low temperature coefficient
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact –K
- Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
CLF Sizes: 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Special layout for high electrical load
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances (=0,5%) – low temperature coefficient (=50ppm/K)
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
- Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
CDP Sizes: 0402, 0603, 0805, 1206
Characteristics:
- Chip resistors in thick film technology
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances (=0,5%) – low temperature coefficient
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
- Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
CNF Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Very low ohmic resistor layers
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
CHF Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Very high ohmic resistor layers
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances
- RoHS-conform
- Standard measuring voltage: 50V
- Application-specific measuring voltage acc. customer specifications available
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
- Special corrosive gas resistant contact –S, Sulfur resistance verified according
to ASTM B 809
CRA Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Resistance area trimmable after manufacturing
- Maximum trimming factor=1,3; higher factors by reducing of Umax or P70 available
- Resistance area coated with glass passivation
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact –K
- Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
CQA Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Resistance area trimmable after manufacturing, clearly seperated for detecting by visual systems
- Maximum trimming factor=1,3; higher factors by reducing of Umax or P70 available
- Resistance area coated with glass passivation
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact –K
- Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
CDI / CLI Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Specially pulse proof resistor layers
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Sticky contact –K
- Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
CNR Sizes: 1206-4 (4 x 0603)
Characteristics:
- Chip resistors in thick film technology
- Four value-equal resistors arranged on one chip to save space
- Contact inside round surfaces of ceramic
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances (=1%) – low temperature coefficient
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact –K
- Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
CDF / CLF-Jumper Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Resistance area coated with glass and varnish passivation
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
Automotive
AMF Sizes: 0603, 0805, 1206
Characteristics:
- Chip resistors in thin film technology
- High-precision resistor layers
- Resistance area coated with surface passivation
- AEC Q200 qualified
- Very tight tolerances (=0,05%) – low temperature coefficient (=10ppm/K)
- Low current noise, good pulse strength
- R-Value-Matching available
- RoHS-conform
- Order quantities from 1000 pieces for <1% and <TCR 50 available by extra charge
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
AMA Sizes: 1206-4 (4 x 0603)
Characteristics:
- Chip resistors in thin film technology
- Four resistors with 2 circuit variants
- Concave contact
- Resistance area coated with surface passivation
- High stability and reliability
- AEC Q200 qualified
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
AMF-Jumper Sizes: 0603, 0805, 1206
Characteristics:
- Chip resistors in thin film technology
- AEC Q200 qualified
- RoHS-conform
- Customer specific barcodes available – also in 2D
- Electroplated pure tin
ADF Sizes: 0402, 0603, 0805, 1206
Characteristics:
- Chip resistors in thick film technology
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- AEC Q200 qualified
- Tight tolerances (=0,5%) – low temperature coefficient
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
ALF Sizes: 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Special layout for high electrical load
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- AEC Q200 qualified
- Tight tolerances (=0,5%) – low temperature coefficient (=50ppm/K)
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
ANF Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Very low ohmic resistor layers
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances
- AEC Q200 qualified
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
AHF Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Very high ohmic resistor layers
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances
- AEC Q200 qualified
- RoHS-conform
- Standard measuring voltage: 50V
- Application-specific measuring voltage acc. customer specifications available
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
ARA Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Resistance area trimmable after manufacturing
- Maximum trimming factor=1,3; higher factors by reducing of Umax or P70 available
- Resistance area coated with glass passivation
- AEC Q200 qualified
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
AQA Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Resistance area trimmable after manufacturing, clearly seperated for detecting by visual systems
- Maximum trimming factor=1,3; higher factors by reducing of Umax or P70 available
- Resistance area coated with glass passivation
- AEC Q200 qualified
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
ADI / ALI Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Specially pulse proof resistor layers
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- AEC Q200 qualified
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
ANR Sizes: 1206-4 (4 x 0603)
Characteristics:
- Chip resistors in thick film technology
- Four value-equal resistors arranged on one chip to save space
- Contact inside round surfaces of ceramic
- Resistance area coated with glass and varnish passivation
- High stability and reliability
- Tight tolerances (=1%) – low temperature coefficient
- AEC Q200 qualified
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
ADF-Jumper Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thick film technology
- Resistance area coated with glass and varnish passivation
- AEC Q200 qualified
- RoHS-conform
- Customer specific barcodes available – also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
DATENBLÄTTER DOWNLOADS
Applikationsspezifische Lösungen und Bauelemente
SMD-Chipwiderstände, -Netzwerke und –Temperatursensoren finden ihr Einsatzgebiet in fast allen Bereichen der Elektronik. Unsere innovativen Technologien und die hohe Fachkompetenz ermöglichen es uns, Ihnen auch applikationsspezifische Lösungen anbieten zu können. Hier einige Beispiele:
- Automotive-Serie, SMD-Chipwiderstände, die den speziellen Anforderungen der Kunden im automotiven Bereich genügen
- Niederohm-Serie, SMD-Chipwiderstände, die u.a. als Stromsensoren eingesetzt werden können
- Hochohm-Serie, SMD-Chipwiderstände, die u.a. in Messverstärkern eingesetzt werden können
- Hochbelastbare Serie, SMD-Chipwiderstände, u.a. speziell für den Einsatz in der Leistungselektronik und Kfz-Technik
- Abgleichbare Serie, SMD-Chipwiderstände, deren Widerstandswert vom Kunden für spezielle Anwendungen selbst eingestellt werden kann
- Impulsfeste Serie, SMD-Chipwiderstände, die u.a. in Netzteilen eingesetzt werden können
- Netzwerke, SMD-Chipwiderstände, u.a. speziell für den Einsatz in hoch integrierten Schaltungen
- Dünnschicht Serie, SMD-Chipwiderstände, die überall dort eingesetzt werden, wo besonders hohe Präzision und Zuverlässigkeit gefordert wird, wie z.B. in der Medizintechnik, der Luftfahrt oder in wissenschaftlichen Geräten
- Temperatursensoren, Sensoren in SMD-Bauform für den Einsatz in der Temperaturmesstechnik und Regeltechnik
- Unterleger (CUT-K), spezielle Ausführung eines SMD-Bauelementes in Form einer metallisierten Keramik, die als Montageträger zum Einsatz kommt
- Testpoints, spezielle Ausführung eines SMD-Chipwiderstandes (0 Ohm), der als Messpunkt auf Leiterplatten verwendet werden kann
- Kompensationswiderstände, Dünnschicht-Chipwiderstand im Niederohm-Bereich mit einem gezielt hergestellten Temperaturkoeffizienten im Bereich von +2000ppm/K
- Heat-Pipe, SMD-Bauelement zur spezifischen Wärmeableitung bei montierten Leiterplatten
- Matching-Widerstände, speziell selektierte Widerstandswerte, die sich in einer Verpackungseinheit nur um +/- 0.02% unterscheiden
